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Finite element analysis of nonlinear deformation mechanisms in semiconductor packages.

机译：半导体封装中非线性变形机制的有限元分析。

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摘要

In this study, three-dimensional finite elements were employed to study interfacial cracking problems encountered in electronic packaging. The study consists of two main parts. Analysis of three-dimensional elastic interface cracks with curved crack fronts and modeling the materially non-linear behavior of solder balls in a semiconductor package with a neighboring elastic interfacial crack.; In the first part of the study, three-dimensional enriched finite elements were employed to solve interfacial semi-circular and quarter-circular corner cracks between silicon and epoxy. These problems were solved for both uniform tensile loading and thermal loading cases. The results showed that, especially for thermal loading problems, there is a strong mode mixity in the stress intensity factors both in terms of mode II and mode III. Also, for problems that involve curved crack fronts, it was concluded that the solution is sensitive to mesh refinement in the crack tip region.; In the second part of this study, the elastic-plastic behavior of solder balls and interaction effects with nearby cracks in a semiconductor package was investigated. Neglecting time dependent effects (creep, viscoplasticity), stress and fracture analyses were performed. Applying periodicity boundary conditions, a slice near the central region of a semiconductor device was considered. In the absence of a crack in the package, a so-called “processing model”, which contains three processing steps, was used to simulate the fabrication of a flip-chip package. The results from this model showed that stresses and strains are not constant along the “z” direction and that the outermost solder ball is most critical in terms of permanent damage. It was also concluded that corners of the fillet are subjected to high residual stresses and that crack initiation can take place in these regions.; Fracture calculations were also performed using the same device and material property specifications. Three differently shaped interfacial cracks near the fillet region were considered. The results from these calculations showed that plastic deformation, especially on the last solder ball, is affected by the presence of a crack in its vicinity and vice versa. It was observed that the plastic strains increase as the crack tip approaches the outermost solder ball. In studying the “L” shaped crack, it was concluded that inclusion of crack surface contact is critical for accurate determination of plastic strains and fracture parameters. (Abstract shortened by UMI.)
机译：在这项研究中，三维有限元被用于研究电子包装中遇到的界面开裂问题。该研究包括两个主要部分。分析具有弯曲裂纹前沿的三维弹性界面裂纹，并模拟具有相邻弹性界面裂纹的半导体封装中焊球的材料非线性行为。在研究的第一部分中，采用了三维富集的有限元来解决硅与环氧树脂之间的界面半圆和四分之一圆角裂纹。这些问题在均匀的拉伸载荷和热载荷情况下均得到解决。结果表明，特别是对于热负荷问题，应力强度因子在模式II和模式III方面都具有很强的模式混合性。同样，对于涉及弯曲裂纹前沿的问题，可以得出结论，该解决方案对裂纹尖端区域中的网格细化敏感。在本研究的第二部分中，研究了半导体封装中焊球的弹塑性行为以及与附近裂纹的相互作用。忽略了时间依赖性效应（蠕变，粘塑性），应力和断裂分析。应用周期性边界条件，考虑了半导体器件中心区域附近的切片。在封装中没有裂缝的情况下，包含三个处理步骤的所谓“处理模型”用于模拟倒装芯片封装的制造。该模型的结果表明，沿“ z”方向的应力和应变不是恒定的，就永久性损坏而言，最外面的焊球最为关键。还得出结论，圆角的角部承受高残余应力，并且在这些区域中可能发生裂纹萌生。断裂计算也使用相同的装置和材料特性规范进行。考虑了圆角区域附近的三个不同形状的界面裂纹。这些计算的结果表明，塑性变形（尤其是在最后一个焊球上）受到附近裂纹的影响，反之亦然。观察到，随着裂纹尖端接近最外面的焊球，塑性应变增加。在研究“ L”形裂纹时，得出的结论是，包括裂纹表面接触对于准确确定塑性应变和断裂参数至关重要。 （摘要由UMI缩短。）

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  • 作者

    Ayhan, Ali Osman.;

  • 作者单位

    Lehigh University.;

  • 授予单位 Lehigh University.;
  • 学科 Engineering Mechanical.; Applied Mechanics.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2000
  • 页码 256 p.
  • 总页数 256
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;应用力学;工程材料学;
  • 关键词

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