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首页> 外文学位 >Orthogonal Spatial Material Flow structures with application to 300mm semiconductor fab automation.
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Orthogonal Spatial Material Flow structures with application to 300mm semiconductor fab automation.

机译：正交空间材料流结构及其在300mm半导体工厂自动化中的应用。

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摘要

To achieve higher utilization of production floor, reduce traffic congestion, and improve travel time efficiency and layout flexibility, material handling system is extended to move loads through every spatial paths to perform factory-wide handling tasks. We designate this material flow structure the Orthogonal Spatial Material Flow (OSMF) structure. Instead of planar (2-D) moves, OSMF structure outlines a three-dimensional material flow network with feasible orthogonal paths between the spatial points which may be spread over factory floor, ceiling, overhead, underground, or multifloor spaces. The OSMF paths can possess multiple flow layers that are laid in the space virtually or physically, vertically or horizontally, disjointedly or connectedly.;The OSMF problem is studied within the context of automated wafer handling systems in semiconductor fabs. As all the goals are set on 300mm. or larger wafer manufacturing for the 21st century, fab automation becomes the current trend in semiconductor fabrication facilities due to the heavy wafer pod (16--20 lbs) and the large flow times distances (360 miles per day).;In this dissertation, a two-layer single-floor OSMF structure is adapted to existing fab layouts. Our approach to the OSMF problem confronts the issues of flow path design and transport service level. We focus on the following developments: (1) overhead interbay track layout design by constructing circular layout for multi-carrier heavy traffic system in interbay zones, (2) overhead intrabay track layout design by developing optimal single and double spine layouts, and (3) mixed model fleet sizing capacity model by M/G/1 queue with server vacations.;To our knowledge, this is the first study of OSMF analysis of material handling systems. The study aims at the development of a generic design framework for OSMF systems and to assist planar material flow systems to expand to OSMF analysis. We demonstrate the static analysis procedures by generating a two-layer mixed model system for semiconductor fabs. The procedures introduced are efficient, requiring only minor computation time, and are applicable to many real-world scenarios. The problem is significant in that, with an OSMF system all the movement activities in the shop floor can be done with less space, cost, and time.
机译：为了实现生产车间的更高利用率，减少交通拥堵并提高出行时间效率和布局灵活性，扩展了物料搬运系统，以使负载沿每个空间路径移动，以执行工厂范围内的搬运任务。我们将此材料流结构指定为正交空间材料流（OSMF）结构。 OSMF结构不是平面（2-D）移动，而是概述了三维材料流网络，在空间点之间具有可行的正交路径，这些路径可能分布在工厂车间，天花板，天花板，地下或多层空间中。 OSMF路径可以具有多个流动层，这些流动层实际上或物理上，垂直或水平，不相交或连接地放置在空间中。OSMF问题是在半导体工厂的自动晶圆处理系统的背景下进行研究的。由于所有目标均设定在300mm。或进入21世纪的大型晶圆制造中，由于晶圆吊舱笨重（16--20磅）和大的流通时间距离（每天360英里），晶圆厂自动化已成为半导体制造设施中的当前趋势。两层的单层OSMF结构适用于现有的晶圆厂布局。我们针对OSMF问题的方法面临着流路设计和运输服务水平的问题。我们专注于以下方面的发展：（1）架空海湾间轨道布局设计，方法是在海湾间区域为多载体重型交通系统构建圆形布局;（2）通过开发最佳的单脊和双脊布局，架空海湾内部轨道布局设计，以及（3 ）通过M / G / 1队列和服务器休假的混合模型车队规模计算模型。据我们所知，这是对OSMF进行物料搬运系统分析的第一项研究。该研究旨在开发OSMF系统的通用设计框架，并协助平面物料流系统扩展到OSMF分析。我们通过为半导体晶圆厂生成两层混合模型系统来演示静态分析程序。引入的过程非常高效，只需要很少的计算时间，并且适用于许多实际情况。问题是严重的，因为有了OSMF系统，车间中的所有移动活动都可以用更少的空间，成本和时间来完成。

著录项

  • 作者

    Ting, Juu-Hwa.;

  • 作者单位

    Purdue University.;

  • 授予单位 Purdue University.;
  • 学科 Engineering Industrial.
  • 学位 Ph.D.
  • 年度 1999
  • 页码 151 p.
  • 总页数 151
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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