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Study of the thermal behavior of a printed circuit board during the reflow process inside a surface mount technology oven

机译：研究表面安装技术烤箱内回流过程中印刷电路板的热行为

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摘要

This thesis presents the development of a numerical model to predict the thermal behavior during the surface mount technology reflow process. The reflow process is a heating process in which the solder paste is melted and then solidified on printed circuit boards (PCBs). Various assumptions were used during the development of the model to simplify the different heat transfer modes present in the problem, including negligible temperature gradient in the vertical direction. The final numerical model was able to predict the temperature profile for an ideal PCB. The ideal PCB consisted of a solid copper plate 0.3048 m by 0.2413 m with a 0.0635 m thickness, dimensions similar to many actual motherboards. Experiments were designed and executed with the objective of gathering data for model calibration. Temperature distributions inside an actual reflow oven were collected simultaneously with temperature measurements along a test board. The reflow oven consisted of twenty heating panels symmetrically distributed below and above the PCB conveyor, as used in actual manufacturing applications. Two oven temperature conditions were considered, namely, ideal and actual set-points, and two conveyor speeds, 1.27 cm/s and 1.905 cm/s. Ideal set-points consisted of uniform temperatures throughout the panels. Comparisons between the numerical and experimental solutions show that the proposed model predicts transient, multi-dimensional heat transfer trends in reflow processes reasonably well. Results indicate that ideal set-point conditions are better predicted by the model, with an average temperature difference of 5.10$spcirc$C. Actual set-point conditions are approximated by the model within an average temperature difference of 9.51$spcirc$C. Major differences between the model and the experimental data were found in the cooling section of the oven. (Abstract shortened by UMI.).
机译：本文提出了一种预测表面贴装技术回流过程中热行为的数值模型。回流过程是加热过程，在该过程中，焊膏熔化，然后在印刷电路板（PCB）上固化。在模型开发过程中使用了各种假设来简化问题中存在的不同传热模式，包括垂直方向上可忽略的温度梯度。最终的数值模型能够预测理想PCB的温度曲线。理想的PCB由0.3048 m x 0.2413 m的实心铜板组成，厚度为0.0635 m，其尺寸与许多实际主板相似。设计和执行实验的目的是收集用于模型校准的数据。沿测试板同时收集实际回流炉内部的温度分布和温度测量值。回流炉由二十个加热板组成，在实际的生产应用中使用，该加热板对称分布在PCB传送带的下方和上方。考虑了两个烤箱温度条件，即理想和实际设定点，以及两个传送带速度，即1.27 cm / s和1.905 cm / s。理想的设定点包括整个面板的均匀温度。数值和实验解决方案之间的比较表明，所提出的模型可以很好地预测回流过程中的瞬态，多维传热趋势。结果表明，模型可以更好地预测理想的设定点条件，平均温度差为5.10°C。实际设定点条件由模型在平均温度差9.51 $ spcirc $ C内估算。模型和实验数据之间的主要区别在于烤箱的冷却部分。 （摘要由UMI缩短。）。

著录项

  • 作者

    Perez Soto, Heriberto.;

  • 作者单位

    University of Puerto Rico, Mayaguez (Puerto Rico).;

  • 授予单位 University of Puerto Rico, Mayaguez (Puerto Rico).;
  • 学科 Mechanical engineering.;Electrical engineering.
  • 学位 M.Sc.
  • 年度 1998
  • 页码 128 p.
  • 总页数 128
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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