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Process and product design for vertically stacked high density memory modules.

机译：垂直堆叠的高密度内存模块的工艺和产品设计。

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摘要

The electronics packaging domain has evolved significantly over the last few decades. Miniaturization, high functionality, low cost and excellent reliability have been the hallmarks of this evolution. An outcome of the demands is 'stacked die DRAMs'. These innovative packages are entering high-volume manufacturing. At the module level, the use of polyimide flexible substrates for the assembly of compactly folded memory modules has proven to be useful for applications in high-end server boards. The use of rigid substrates (memory cards) to assemble stacked high density memory modules is a unique technology that was studied in this research endeavor.;This product technology, named bridge LRDIMM, uses two independently built high density memory cards that can be stacked together using an interposer and a heat sink assembly. LRDIMM-related product technology is relatively new, and has not been systematically and thoroughly researched. There is a definite need for methodical research with respect to product design and process stability, which is the overall objective of this research endeavor. The experimental approach utilized for this study enabled the characterization of the bridge LRDIMM sub-assembly reflow process, and provided an understanding of the effects of interposer weight on the solder joint stand off and substrate warpage during reflow. A threshold weight was calculated based on this study. The evaluation of the stacking mechanism enabled the analysis and improvement of the existing stacking mechanism. Therefore, a stable repeatable stacking process was established based on the outcome of this experimental analysis. Next, to enhance the thermal performance of the module during operation, cooling guidelines were established based on the results of a simulation and an experimental study. A convective fan with a minimum air speed of 4 m/s was recommended. Further, the assembly process was validated by performing reliability tests on the newly assembled modules. The results indicated that the module had the required robustness in design and quality to perform reliably in the field.
机译：在过去的几十年中，电子封装领域发生了巨大的变化。小型化，高功能，低成本和出色的可靠性已成为这一发展的标志。需求的结果是“堆叠裸片DRAM”。这些创新的包装正在进入批量生产。在模块级别，已证明使用聚酰亚胺柔性基板组装紧凑折叠的内存模块对于高端服务器主板中的应用很有用。使用刚性基板（存储卡）组装堆叠的高密度存储模块是一项独特的技术，已在本研究中得到了研究。该产品技术名为Bridge LRDIMM，它使用两个可以独立堆叠的高密度存储卡进行堆叠使用插入器和散热器部件。与LRDIMM相关的产品技术相对较新，尚未进行系统和彻底的研究。绝对需要在产品设计和过程稳定性方面进行系统的研究，这是本研究工作的总体目标。这项研究使用的实验方法能够表征桥LRDIMM子组件的回流工艺，并提供了中介层重量对回流期间焊点间距和基板翘曲的影响的了解。基于该研究计算了阈值权重。通过对堆叠机制的评估，可以对现有堆叠机制进行分析和改进。因此，基于此实验分析的结果，建立了稳定的可重复堆叠过程。接下来，为了提高模块在运行过程中的热性能，基于模拟和实验研究的结果建立了冷却准则。建议使用最小风速为4 m / s的对流风扇。此外，通过对新组装的模块进行可靠性测试来验证组装过程。结果表明，该模块在设计和质量上均具有所需的鲁棒性，以在现场可靠地执行。

著录项

  • 作者

    Ranade, Ajinkya Prakash.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Industrial engineering.;Mechanical engineering.
  • 学位 Ph.D.
  • 年度 2015
  • 页码 260 p.
  • 总页数 260
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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