The residual stresses found in components are mainly due to thermal, mechanical and metallurgical changes of material. The manufacturing processes such as fabrication, assembly, welding, rolling, heat treatment, shot peening etc. generate residual stresses in material.;A significant number of improvements for residual stress measurement techniques have occurred in last few decades. The needs of Digital Image Correlation (DIC) techniques from industry have been increasing, especially in micro- and nano-scale mechanical testing applications mainly due to its relative easy implementation and utilization. In this dissertation, new experimental and numerical methods have been carried out, using a 3D-DIC measurement system with hole drilling operations and Finite Element Analysis (FEA) models to successfully predict both uniform and non-uniform residual stresses in material. The residual stresses have been calculated based on the established governing equations, 3D-DIC measured deformations, and calibration coefficients determined by finite element analyses. This 3D-DIC measurement technique performed in a no contact approach can capture the full-field, high sensitivity and high accuracy in-plan and out-of-plan deformation simultaneously. It can be used for both industrial and lab environments.;There are three main categories for residual stress evaluations and validations in this dissertation. They are listed as following: 1) Through hole drilling (THD) on thin parts for uniform residual stresses; 2) Blind hole drilling (BHD) on thick parts for uniform residual stresses, where it is not possible to drill a through hole; 3) Incremental blind hole drilling (IBHD) on thick parts for non-uniform residual stresses which vary as a function of depth.
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