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Influence of the volume-contact area ratio on the growth behavior of the Cu-Sn intermetallic phase.

机译：体积接触面积比对Cu-Sn金属间相生长行为的影响。

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摘要

Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic feasibility and miniaturization led to the development of high density interconnects. With the reduction in the size/standoff height of the solder reliability issues in the surface mount assemblies and packaging structures under various rigorous environments are becoming significant.;One of the most important impact factors that affect the solder joint reliability is the growth rate IMC formed between the solder and substrate with reduction in joint size. IMC formation is required to ensure good bonding and connectivity of the device in packaging. However excess IMC growth rate is detrimental to the device from mechanical aspects due to its brittle nature. Thus there is a need to study effect the IMC growth rate behavior with the solder joint size/standoff height.;In this present study, two solder joints of different standoff heights and same composition (pure Sn solder) are used subjected to reflow process at 270°C for 1--7 min to study solid liquid interfacial reaction on joint size and the same experiment is repeated with SAC alloy of composition (96.5% Sn, 3.0% Ag, 0.5% Cu) to investigate the effect of joint size and initial copper concentration on IMC growth rate. The IMC thickness of the Sn 15microm solder joint at 1 min and 7 min is found to be 1.52microm and 2.86microm respectively while that of Sn 150microm solder joint is 1.31microm and 3.16 microm. The thickness is high in low standoff height sample at the early stage of reaction with decrease in IMC growth rate as the time of reflow increases. In case of 25microm SAC alloy solder joint the IMC thickness from 1 and 7 min is found to be 2.1microm and 3.5microm while that of 250microm SAC alloy solder joint its 1.43microm and3.235microm. Similar trend is observed but the IMC thickness is more in SAC alloy compared to Pure Sn due to initial Cu concentration effect. The CGC model is applied for growth kinetics of IMC formation and is in well agreement with the experimental results. It is found that the low standoff height solder joint follow t1/3 law and high standoff height solder joint deviates from the t1/3 due to unsaturation.;The pure Sn solder of two different standoff heights is also subjected to isothermal aging tests at 120°C for 0--600 hours to investigate the effect of IMC growth rate on solder joint size in solid state diffusion. It has been found that low solder joint height is having high growth rate compared to high standoff height joint and it is found to obey parabolic law and follow reaction diffusion control mechanism.
机译：焊点通过充当机械支撑并为设备提供完整性，在电子包装行业中扮演着非常重要的角色。对高性能，环境和经济可行性以及小型化的日益增长的需求导致了高密度互连的发展。随着焊锡尺寸/支架高度的减小，在各种严酷环境下表面贴装组件和封装结构中的问题变得越来越重要。影响焊点可靠性的最重要影响因素之一是IMC的生长速度焊锡和基板之间的距离减小了。需要形成IMC，以确保包装中的设备具有良好的粘合性和连通性。但是，由于IMC的脆性，过高的IMC增长率从机械方面不利于该设备。因此，有必要研究IMC生长速率行为对焊点尺寸/支脚高度的影响。在本研究中，使用支脚高度不同且成分相同的两个焊点（纯锡焊料）在回流温度下进行焊接。在270°C下进行1--7分钟以研究固液界面反应对接缝尺寸的影响，并用组成为96.5％Sn，3.0％Ag，0.5％Cu的SAC合金重复相同的实验，以研究接缝尺寸和接缝的影响​​。初始铜浓度对IMC增长率的影响。发现Sn 15微米焊点在1分钟和7分钟处的IMC厚度分别为1.52微米和2.86微米，而Sn 150微米焊点的IMC厚度分别为1.31微米和3.16微米。在低支架高度的样品中，在反应的早期，其厚度较高，随着回流时间的增加，IMC的生长速率降低。对于25微米SAC合金焊点，发现1和7分钟的IMC厚度分别为2.1微米和3.5微米，而250微米SAC合金焊点的厚度为1.43微米和3.235微米。观察到相似的趋势，但是由于初始的铜浓度效应，与纯锡相比，SAC合金中的IMC厚度更大。该CGC模型用于IMC形成的生长动力学，与实验结果吻合良好。发现低支座高度焊点遵循t1 / 3规律，高支座高度焊点由于不饱和而偏离t1 / 3 .;两种不同支座高度的纯锡焊料也要在120°C下进行等温老化测试°C进行0--600小时，以研究IMC生长速率对固态扩散中焊点尺寸的影响。已经发现，与高支座高度接头相比，低焊点高度具有较高的生长速率，并且发现其遵循抛物线定律并遵循反应扩散控制机制。

著录项

  • 作者

    Giddaluri, Venkatakamakshi Supraja.;

  • 作者单位

    The University of Texas at Arlington.;

  • 授予单位 The University of Texas at Arlington.;
  • 学科 Materials science.;Electrical engineering.
  • 学位 M.Eng.
  • 年度 2015
  • 页码 73 p.
  • 总页数 73
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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