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首页> 外文学位 >A thz focal plane imaging array using metamaterial-inspired bolometer and wafer-level integrated focusing elements.
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A thz focal plane imaging array using metamaterial-inspired bolometer and wafer-level integrated focusing elements.

机译：Thz焦平面成像阵列，采用超材料激发的辐射热计和晶圆级集成聚焦元件。

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摘要

There is substantial interest in terahertz (THz) for applications in communications, sensing, spectroscopy, imaging, and security. Existing THz systems are built using quasi-optical setups. To reduce cost and make THz integrated circuits a reality, approaches to wafer level integration of components is critically needed. Among the many THz systems, imagers are most desirable as they can be immediately adopted for applications in medical-imaging, security, and non-destructive evaluation (NDE). Many types of detectors have been studied in the design and fabrication of THz focal plane arrays such as Schottky diode rectifiers and bolometers. A typical focal plane array (FPA) pixel element consists of a read-out circuitry, detector device and an antenna or a lens element. A 100x100 element FPA will require 10,000 of these individual elements. Pick-and-place of such a large number of elements within a small foot print is cost prohibitive and technically challenging. Wafer level integration of these elements is desirable to overcome this challenge. Among the many detector elements, bolometers are desirable as they are simple to implement and has the potential to provide high sensitivity. At THz frequencies a bolometer has to be directly coupled to an antenna element to achieve high coupling efficiency. However, antennas thermally load the bolometers and reduce the overall sensitivity. Thus, new approaches to integrating bolometer with antenna elements are needed to achieve high sensitivity. Furthermore, new approaches to improving intrinsic sensitivity of a bolometer in the THz spectral region are needed. Key focus of this research is towards the design and demonstration of THz metamaterial based absorbing structures and their utilization in the design of absorbers for packaging and bolometers for focal plane arrays (FPAs), with major research focus on the design and implementation of THz focal plane arrays. A range of bolometer designs based on metamaterial structures are investigated, including cross, circles, Minkowski, and slit ring resonator which are implemented using high resistive thin metal films. Minituarized unitcells are designed, fabricated and tested in order to improve the sensitivity of the bolometers. For beam focusing and enhanced coupling efficiency to the detector elements (bolometers), wide-band micro-lens array are designed and demonstrated. These microlens arrays can be fabricated at the wafer level using 3D printing. Furthermore, a new plasmonic antenna element is demonstrated that can also be utilized in place of the conventional micro-lens design. This antenna element is integrated in close proximity to the bolometer structures while avoiding thermal loading the detector element. Performance of this antenna element is presented in comparison to conventional antenna elements. A THz imaging array that integrates the detector elements and lens element at the wafer level is demonstrated as part of this research work. Apart from imaging array, under this research work, approaches to fabricating 3D THz components at the wafer level have been demonstrated through the use of 3D printing and deep metal etching processes.
机译：太赫兹（THz）在通信，传感，光谱学，成像和安全领域的应用引起了人们极大的兴趣。现有的THz系统是使用准光学设置构建的。为了降低成本并使THz集成电路成为现实，迫切需要实现组件的晶圆级集成的方法。在许多太赫兹系统中，最需要成像器，因为它们可以立即用于医学成像，安全性和无损评估（NDE）中。在THz焦平面阵列的设计和制造中，已经研究了许多类型的检测器，例如肖特基二极管整流器和辐射热计。典型的焦平面阵列（FPA）像素元件由读出电路，检测器设备以及天线或透镜元件组成。 100x100元素FPA将需要10,000个这些单独的元素。在小的占地面积内如此大量元件的拾取和放置成本高昂，并且在技术上具有挑战性。这些元件的晶圆级集成是克服这一挑战所需要的。在许多检测器元件中，辐射热计是理想的，因为它们易于实现并且具有提供高灵敏度的潜力。在太赫兹频率下，辐射热计必须直接耦合到天线元件，以实现高耦合效率。但是，天线会向测辐射热仪施加热量，并降低整体灵敏度。因此，需要将辐射热计与天线元件集成在一起的新方法以实现高灵敏度。此外，需要新的方法来改善辐射热计在THz频谱区域的固有灵敏度。这项研究的主要重点是基于太赫兹超材料的吸收结构的设计和演示，以及它们在焦平面阵列（FPA）的包装吸收器和辐射热计的设计中的利用，主要研究重点是太赫兹焦平面的设计和实现数组。研究了基于超材料结构的一系列辐射热计设计，包括使用高电阻金属薄膜实现的十字形，圆形，Minkowski和狭缝环形谐振器。设计，制造和测试最小化的晶胞，以提高辐射热测量计的灵敏度。为了使光束聚焦并提高与检测器元件（辐射热测量仪）的耦合效率，设计并演示了宽带微透镜阵列。这些微透镜阵列可以使用3D打印在晶圆级别上制造。此外，展示了一种新的等离子天线元件，该天线元件也可以代替传统的微透镜设计使用。该天线元件与辐射热计结构紧密集成在一起，同时避免了对检测器元件造成热负荷。与传统天线元件相比，该天线元件的性能得以展示。作为这项研究工作的一部分，展示了在晶片级集成检测器元件和透镜元件的太赫兹成像阵列。除了成像阵列，在这项研究工作下，通过使用3D打印和深金属蚀刻工艺，还展示了在晶圆级制造3D THz组件的方法。

著录项

  • 作者

    Park, Kyoung Youl.;

  • 作者单位

    Michigan State University.;

  • 授予单位 Michigan State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2014
  • 页码 207 p.
  • 总页数 207
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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