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首页> 外文学位 >Solder joint reliability of tin and tin-bismuth finished and refinished tin (SAC/tin lead) SMT packages under temperature cycling test.
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Solder joint reliability of tin and tin-bismuth finished and refinished tin (SAC/tin lead) SMT packages under temperature cycling test.

机译：在温度循环测试下，锡和锡铋成品和成品锡（SAC /锡铅）SMT封装的焊点可靠性。

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摘要

Solder dip may be used as a peripheral leaded terminal refinishing process to replace the original pure tin finish with eutectic tin-lead finish to mitigate tin-whisker risk. Tin-silver-copper is an option of lead-free terminal finish. Solder dip is the way to obtain tin-silver-copper finish. However, the reliability of solder joints formed with these refinished terminals may be affected by the refinishing process. The solder joint reliability of refinished components under temperature cycling conditions need to be determined to study the effects of refinishing on the solder joint reliability. Tin-bismuth terminal finish is another tin-whisker mitigation strategy. The reliability of solder joints under temperature cycling conditions formed with tin-bismuth finished terminals also needs to be determined before the implementation.The microstructure and strength of solder joints formed with refinished terminals were evaluated by comparing with those of solder joints formed with original pure tin finished terminals. The reliability of solder joints formed with original pure tin finished terminals, refinished terminals and original tin-bismuth finished terminals were tested under temperature cycling.Under temperature cycling test, solder joints formed with Sn3.0Ag0.5Cu solder dipped terminals have shorter characteristic life for thin-small-outline-packages but longer characteristic life for 2512 resistors than those formed with the original pure tin finished terminals in both eutectic SnPb and Sn3.0Ag0.5Cu solder assembly. Solder joints formed with eutectic SnPb dipped terminals have equal characteristic life for thin-small-outline-packages, but longer characteristic life for 2512 resistors than those formed with the original pure tin finished terminals when reflowed with eutectic SnPb solder. Solder joints formed with tin-bismuth finished terminals have shorter characteristic life than original pure tin finished terminals for thin-small-outline-packages for both eutectic SnPb and Sn3.0Ag0.5Cu solder assembly.If a 20% decrease in characteristic life of solder joints under temperature cycling conditions is acceptable, then the SAC solder dip process can be a potential choice for refinishing purpose. SnPb solder dip process is a good choice of refinish process without causing degradation to characteristic life under temperature cycling conditions. If a 25% decrease in characteristic life of solder joints under temperature cycling conditions can be accepted, then SnBi finish can be an alternative finish to tin finish.
机译：焊锡浸涂可以用作外围引线端子的修补工艺，以低共熔锡铅漆代替原始的纯锡漆，以减轻锡须风险。锡-银-铜是无铅端子的选择。浸焊是获得锡银铜涂层的方法。但是，由这些精加工端子形成的焊点的可靠性可能会受到精加工过程的影响。需要确定在温度循环条件下修整后的零件的焊点可靠性，以研究修补对焊点可靠性的影响。锡铋端子表面处理是另一种缓解锡须的策略。在实施之前还需要确定锡铋精加工端子形成的焊点在温度循环条件下的可靠性。通过与精纯锡形成的焊点相比，对精加工端子形成的焊点的微观结构和强度进行了评估。完成的终端。在温度循环下测试了由原始纯锡制成的端子，精加工端子和原始锡铋制成的端子形成的焊点的可靠性。在温度循环测试下，由Sn3.0Ag0.5Cu浸锡端子形成的焊点具有较短的特性寿命。外形小巧，外形紧凑，但2512电阻器的特性寿命比共晶SnPb和Sn3.0Ag0.5Cu焊料组件中的原始纯锡成品端子形成的电阻器更长。用共晶SnPb浸入端子形成的焊点对于薄小外形封装的特征寿命相同，但是当使用共晶SnPb焊料回流时，2512电阻器的特征寿命比用原始的纯锡制成的端子更长。对于共晶SnPb和Sn3.0Ag0.5Cu焊料组件，采用薄薄小外形封装的锡铋成品端子形成的焊点的特性寿命比原始纯锡成品端子的特性寿命短。如果焊料的特性寿命降低20％在温度循环条件下的焊缝是可以接受的，那么SAC浸焊工艺可能是修补漆的潜在选择。 SnPb焊料浸涂工艺是修补工艺的不错选择，而不会在温度循环条件下降低特性寿命。如果可以接受在温度循环条件下焊点的特征寿命降低25％，那么SnBi涂层可以替代锡涂层。

著录项

  • 作者

    Wang, Weiqiang.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Mechanical.
  • 学位 M.S.
  • 年度 2009
  • 页码 84 p.
  • 总页数 84
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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