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Magnetic self-assembly of small parts.

机译：磁性自组装的小零件。

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摘要

Modern society's propensity for miniaturized end-user products is compelling electronic manufacturers to assemble and package different micro-scale, multi-technology components in more efficient and cost-effective manners. As the size of the components gets smaller, issues such as part sticking and alignment precision create challenges that slow the throughput of conventional robotic pick-n-place systems. As an alternative, various self-assembly approaches have been proposed to manipulate micro to millimeter scale components in a parallel fashion without human or robotic intervention. In this dissertation, magnetic self-assembly (MSA) is demonstrated as a highly efficient, completely parallel process for assembly of millimeter scale components.;MSA is achieved by integrating permanent micromagnets onto component bonding surfaces using wafer-level microfabrication processes. Embedded bonded powder methods are used for fabrication of the magnets. The magnets are then magnetized using pulse magnetization methods, and the wafers are then singulated to form individual components. When the components are randomly mixed together, self-assembly occurs when the intermagnetic forces overcome the mixing forces.;Analytical and finite element methods (FEM) are used to study the force interactions between the micromagnets. The multifunctional aspects of MSA are presented through demonstration of part-to-part and part-to-substrate assembly of 1 mm x 1mm x 0.5 mm silicon components. Part-to-part assembly is demonstrated by batch assembly of free-floating parts in a liquid environment with the assembly yield of different magnetic patterns varying from 88% to 90% in 20 s. Part-to-substrate assembly is demonstrated by assembling an ordered array onto a fixed substrate in a dry environment with the assembly yield varying from 86% to 99%. In both cases, diverse magnetic shapes/patterns are used to control the alignment and angular orientation of the components. A mathematical model is used to characterize part-to-substrate MSA. It is shown that the assembly rate and the yield are most dependent on the rotational symmetry of the magnet pattern. Simultaneous and sequential heterogeneous assembly of two types of parts with selective bonding is also demonstrated, with the average assembly yield of 93% in 60 s and 99% in 3.5 min respectively. Finally, MSA with functional electrical interconnects is also demonstrated with a yield of 90.5%.
机译：现代社会对最终用户产品小型化的倾向正迫使电子制造商以更有效和更具成本效益的方式组装和包装不同的微型，多技术组件。随着组件的尺寸变小，诸如零件粘着和对准精度之类的问题带来了挑战，从而减慢了传统的自动贴装系统的吞吐量。作为替代，已经提出了各种自组装方法，以在没有人或机器人干预的情况下以并行方式操纵微米至毫米级的部件。在本文中，磁自组装（MSA）被证明是一种高效，完全并行的毫米级部件组装过程。MSA是通过使用晶圆级微加工工艺将永久性微磁体集成到部件粘结表面上而实现的。嵌入式粘结粉末法用于制造磁体。然后使用脉冲磁化方法将磁体磁化，然后将晶片切单以形成单个组件。当组件随机混合在一起时，当电磁力克服混合力时就会发生自组装。;分析和有限元方法（FEM）用于研究微磁体之间的力相互作用。通过演示1毫米x 1毫米x 0.5毫米硅组件的零件到零件和零件到基板的组装，展示了MSA的多功能方面。零件到零件的组装通过在液体环境中自由浮动零件的批量组装来演示，在20 s内不同磁性图案的组装良率在88％到90％之间变化。通过在干燥环境中将有序阵列组装到固定基板上来演示零件到基板的组装，组装成品率从86％到99％不等。在这两种情况下，都使用各种磁性形状/图案来控制组件的对齐和角度方向。数学模型用于表征零件到基板的MSA。结果表明，组装速度和成品率最依赖于磁体图案的旋转对称性。还展示了两种类型的具有选择性键合的零件的同时和顺序异质组装，其平均组装良率在60 s内为93％，在3.5 min内为99％。最后，还证明了具有功能性电气互连的MSA，产率为90.5％。

著录项

  • 作者

    Shetye, Sheetal B.;

  • 作者单位

    University of Florida.;

  • 授予单位 University of Florida.;
  • 学科 Engineering Electronics and Electrical.;Physics Electricity and Magnetism.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 159 p.
  • 总页数 159
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:38:25

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