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首页> 外文学位 >Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes.
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Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes.

机译：镀银和镍/钯基引线框架镀层表面处理的二次引线键合完整性的评估。

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摘要

As the legislatures demand the use of lead (Pb) free plating finishes in lead frame manufacturing, the industries have witnessed different plating finishes from the lead frame makers. The development of a new lead frame finish involves a wide variety of issues which must be addressed and thus mandates further evaluation of these new structures.;Using the common Pb free lead frame plating finish of selectively plated silver (Ag) as a basis, a comparative approach was used to evaluate the secondary wire bond integrity of a 25 micron (1 mil) gold wire on Ni/Pd based lead frame plating finishes. The integrity of the secondary wire bonds for four different plating finishes was investigated at various assembly thermal exposure stages using the wire pull strength test as the arbiter. Reliability tests, such as high temperature storage (HTS) and unbiased highly accelerated stress test (UHAST), were also conducted. Finally, failure analysis was conducted with the help of metallographic cross sectioning, SEM/EDX analysis and statistical analysis of the wire pull strength test results.;Failure analysis showed that there were silver and copper migrations over the silver (Ag) plated lead frame when exposed to the high temperature storage test, but this did not affect the bond integrity. However, the Ni/Pd based lead frames did not show any metal migration since nickel acts as a barrier against the base metal diffusion. The wire pull results for all cases showed only a heel break at the secondary bond with no pad lift on any of the lead frame types.
机译：由于立法机关要求在引线框架制造中使用无铅电镀涂层，因此行业见证了与引线框架制造商不同的电镀涂层。开发新的引线框架精加工涉及许多问题，必须解决这些问题，因此需要对这些新结构进行进一步评估。使用选择性镀银（Ag）的常见无铅引线框架电镀精加工作为基础，比较方法被用来评估25微米（1密耳）金丝在基于Ni / Pd的引线框架电镀表面处理中的次级丝焊完整性。使用拉丝强度测试作为判优器，在不同的装配热暴露阶段研究了四种不同镀层的二次引线键合的完整性。还进行了可靠性测试，例如高温存储（HTS）和无偏高加速应力测试（UHAST）。最后，借助金相截面，SEM / EDX分析和对拉线强度测试结果的统计分析，进行了失效分析；失效分析表明，当镀银（Ag）引线框架时，银和铜迁移暴露于高温存储测试中，但这并没有影响键的完整性。然而，基于镍/钯的引线框架没有显示出任何金属迁移，因为镍充当了阻止贱金属扩散的屏障。所有情况下的拉线结果均显示，在次级键合处仅发生了跟部断裂，而在任何引线框类型上均没有焊盘抬起。

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  • 作者

    Srinivasan, Guruprasad.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Engineering Mechanical.;Engineering Materials Science.
  • 学位 M.S.
  • 年度 2008
  • 页码 142 p.
  • 总页数 142
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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