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Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders

机译：锡基无铅焊料中β-锡的成核，生长和结构

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作者
Reeve, Thomas C.;
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作者单位

Purdue University.;

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授予单位 Purdue University.;
学科
学位 Ph.D.
年度 2018
页码 264 p.
总页数 264
原文格式 PDF
正文语种 eng
中图分类 AAI10808283;
关键词
Grain refinement; Lead-free; Metallurgy; Nucleation; Solder; Solidification;

机译：谷物改进;无铅;冶金;成核;焊接;凝固;

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专利

1. Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys [J] . Reeve Kathlene N., Handwerker Carol A. Journal of Electronic Materials . 2018,第1期

机译：铝制改性无铅焊料合金中的β-锡籽粒形成
2. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys [J] . Reeve Kathlene N., Anderson Iver E., Handwerker Carol A. Journal of Electronic Materials . 2015,第3期

机译：Al修饰的Sn-Cu和Sn-Ag-Cu无铅焊料合金中Cu-Al金属间化合物的成核和生长
3. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified nSn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys [J] . Kathlene N. Reeve, Iver E. Anderson, Carol A. Handwerker Journal of Electronic Materials . 2015,第3期

机译：Al改性nSn-Cu和Sn-Ag-Cu无铅焊料合金中Cu-Al金属间化合物的形核和生长
4. COMPARISON OF CREEP LIFE ASSESSMENT BETWEEN TIN-BASED LEAD-FREE SOLDERS AND LEAD SOLDERS [C] . Kenji Monden TMS annual meeting exhibition;Symposium on characterization of minerals, metals, and materials . 2012

机译：锡基无铅焊料与铅焊料蠕变寿命评估的比较
5. Influence of nano-structured chemicals on the microstructures and mechanical reliability of lead-free tin-based solders. [D] . Choudhuri, Deep. 2009

机译：纳米结构化学物质对无铅锡基焊料的微观结构和机械可靠性的影响。
6. Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder [O] . Chien-Hsun Wang, Ho-Lin Tsai, Weng-Sing Hwang 2017

机译：熔融无铅焊料直接印刷一维和二维电子导电结构
7. Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys [O] . John W. Elmer, Eliot D. Specht, Mukul Kumar 2010

机译：与无铅焊锡合金相关的β-Sn形核的过冷组织和原位观察

Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders

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