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Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications

机译：研究高功率密度电子应用的Si基嵌入式微型通道-3D歧管冷却系统的热流体性能

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作者
?Jung, Ki Wook;
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作者单位

Stanford University;

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授予单位 Stanford University;
学科
学位 Ph.D.
年度 2020
页码 140 p.
总页数 140
原文格式 PDF
正文语种 eng
中图分类
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1. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance [J] . Ki Wook Jung, Chirag R. Kharangate, Hyoungsoon Lee, International Journal of Heat and Mass Transfer . 2019,第MARa期

机译：具有3D歧管的嵌入式冷却系统，用于车辆电力电子应用：单相导热性能
2. Investigation of natural convection heat transfer performance of the QFN-PCB electronic module by using nanofluid for power electronics cooling applications [J] . Purusothaman A. Advanced Powder Technology: The internation Journal of the Society of Powder Technology, Japan . 2018,第4期

机译：用纳米流体进行电力电子冷却应用对QFN-PCB电子模块自然对流传热性能的研究
3. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (～1 kW/cm~2) Power Electronics Cooling [J] . Kl Wook Jung, Sougata Hazra, Heungdong Kwon, Journal of Electronic Packaging . 2020,第3期

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4. INVESTIGATION OF HIGH PERFORMANCE HEAT SINK CHARACTERISTICS IN FORCED CONVECTION COOLING OF POWER ELECTRONIC SYSTEMS [C] . Giti Karimi-Moghaddam, Richard D. Gould, Craig Rende, ASME international mechanical engineering congress and exposition;IMECE2011 . 2012

机译：电力电子系统强制对流冷却中高性能散热片特性的研究
5. Study of the Condensation Performance of Composite Coating on Copper Surfaces for Use in Solar-powered Adsorption Cooling Systems [D] . Zhu, Longqian 2018

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6. Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics [O] . Sumit Sinha-Ray, Wenshuo Zhang, Barak Stoltz, 2017

机译：在纳米纹理表面上沸腾的水池状沸腾用于与大功率微电子冷却相关的微重力应用
7. Evaluation of the thermal performance with different fin shapes of the air-cooled heat sink for power electronic applications [O] . Chang-Woo Han, Seung-Boong Jeong 2016

机译：评估用于电力电子应用的风冷散热器的不同翅片形状的热性能
8. Power Electronics Technology Applications for Future SSBNs (By Using Switching Regulator Power Supplies in SSBN Electronic Systems, Reduced Costs and Improved Performance can be Reflected in Both the Electronic and Electrical Power Systems). [R] . Foutz, J., Kamm, E. 1978

机译：用于未来ssBN的电力电子技术应用（通过在ssBN电子系统中使用开关稳压器电源，降低成本和改进的性能可以在电子和电力系统中得到反映）。

Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications

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