通过接触角测定、金相显微分析、增重法和分子动力学模拟研究了以2-甲基-5-(戊基二硫代)-1,3,4-噻二唑为主要成分的复配型缓蚀剂(TSJ-T6)、2-巯基-5-甲基-1,3,4-噻二唑(MMTD)和2,5-二巯基-1,3,4-噻二唑( DMTD)对银片在单质硫与硫醇共存体系中的缓蚀性能。由接触角和金相显微分析结果可以看出,缓蚀剂分子通过吸附作用在银片与腐蚀介质之间形成了缓蚀膜,对银片的腐蚀起到了良好的抑制作用；增重实验结果表明,三种缓蚀剂在较低浓度时对银片均具有良好的缓蚀效果,其中以TSJ-T6的缓蚀性能最优；且三种缓蚀剂在银片表面的吸附均符合Langmuir吸附等温方程；通过分子动力学模拟研究了缓蚀剂在Ag (111)表面的吸附行为。%Contact angle measurement,metallographic microscopic analysis,weight gain method and molecular dynamics simulation had been studied in the experiment. TSJ-T6,MMTD and DMTD were used as the corrosion inhibitor for silver strips. The corrosive solution was the sulfur and mercaptan concomitant system. Contact angle measurement and the metallographic microscopic analysis results showed that inhibitive layer was formed on the metal/solution interface during to the adsorption of inhibitor. Weight gain measurement results showed that all the three corrosion inhibitors work well when the concentration of the inhibitors was low,and the TSJ-T6 was optimal. Meanwhile,all the adsorptions on the surface of the silver strips met the Langmuir isothermal adsorption e-quation. The molecular simulation had been used to simulate the adsorption model of inhibitor molecules on Ag(111)surface.
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