A circuit design technology and packaging application plan of wafer level package ( WLCSP ) is depicted based on two channel multifunction chipset which adopts 0.18 μm SiGe BiCMOS technology and vector sum struc-ture. Testing results show that the chip gain is over 12 dB,the output power is greater than 7 dBm,the RMS phase error is less than 7°,channel isolation more than 28 dB,the single channel current is less than 90 mA. The chip can greatly reduce the cost and volume of phased array systems,and it provides the basis for the development of 5 G communications,satellite communications and other applications.%论述了一种基于芯片级封装(WLCSP)的双通道多功能芯片电路设计技术和封装应用方案,采用0.18μm SiGe BiCMOS工艺并基于有源矢量合成结构进行设计,测试结果表明该芯片增益大于12 dB,输出功率大于为7 dBm,移相精度小于7°,通道隔离度大于28 dB,单通道功电流小于90 mA,该芯片可大幅降低相控阵系统成本和体积,为5 G通信、卫星通信等应用领域提供研制基础.
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