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High Refractive Index Ti3O5 Films for Dielectric Metasurfaces

         

摘要

Ti3O5 films are deposited with the help of an electron beam evaporator for their applications in metasurfaces.The film of subwavelength (632nm) thickness is deposited on a silicon substrate and annealed at 400℃.The ellipsometry result shows a high refractive index above 2.5 with the minimum absorption coefficient in the visible region,which is necessary for high efficiency of transparent metasurfaces.Atomic force microscopy analysis is employed to measure the roughness of the as-deposited films.It is seen from micrographs that the deposited films are very smooth with the minimum roughness to prevent scattering and absorption losses for metasurface devices.The absence of grains and cracks can be seen by scanning electron microscope analysis,which is favorable for electron beam lithography.Fourier transform infrared spectroscopy spectroscopy reveals the transmission and reflection obtained from the film deposited on glass substrates.The as-deposited film shows high transmission above 60%,which is in good agreement with metasurfaces.

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  • 来源
    《中国物理快报:英文版》 |2017年第8期|141-143|共3页
  • 作者单位

    Department of Electrical Engineering, Information Technology University of the Punjab, Lahore 54000, Pakistan;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Chemical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Electrical Engineering, Information Technology University of the Punjab, Lahore 54000, Pakistan;

    Centre for Advanced Studies in Physics, GCU, Lahore 54000, Pakistan;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Electrical Engineering, Information Technology University of the Punjab, Lahore 54000, Pakistan;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Chemical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Mechanical Engineering, Pohang University of Science and Technology(POSTECH), Pohang 37673,Republic of Korea;

    Department of Electrical Engineering, Information Technology University of the Punjab, Lahore 54000, Pakistan;

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