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Microstructure Transition of Liquid Metal Al During Heating and Cooling Processes

         

摘要

A simulation study of the transition properties of microstructures of liquid metal Al during heating and cooling rnprocesses has been performed by the molecular dynamics method. It is demonstrated that in the temperature rnrange of 1800-350K, the 1551, 1541, 1431, 1311, 1321 and 1422 bond types represented by the HoneycuttrnAndersen index play an important role. Especially, the 1551 bond type plays a leading role and is the decisive rnfactor for the change of the second peak of the pair distribution function from a smooth sine peak into two split rnsecondary peaks via a platform during all the processes of microstructure transitions. From the variation curve of rnthe 1551 bond type, it can be clearly seen that there are five rapidly changing ranges corresponding qualitatively rnto the critical transition points of microstructures of the system detected experimentally.

著录项

  • 来源
    《中国物理快报:英文版》 |2001年第10期|1383-1387|共5页
  • 作者单位

    Department of Physics, Hunan University, Changsha 410082;

    Department of Physics, Hunan University, Changsha 410082;

    Department of Physics, Hunan University, Changsha 410082;

    Department of Chemistry, Hunan University, Changsha 410082;

    Department of Chemistry, Hunan University, Changsha 410082;

    Department of Electrical Engineering, Hunan University, Changsha 410082;

  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 物理学;
  • 关键词

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