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首页> 外文期刊>极端制造（英文） >Femtosecond laser additive and subtractive micro-processing:enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging
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Femtosecond laser additive and subtractive micro-processing:enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging

机译：飞秒激光添加剂和减法微处理：为多芯光纤到硅光子封装提供高通道密度的二氧化硅中介层

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摘要

Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent materials.Research advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro-and nano-scale precision.In this paper,these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components,specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic(SiP)processors for use in telecom and data centres.An 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres(MCFs)to a SiP chip.Femtosecond laser irradiation followed by chemical etching was further harnessed to open alignment sockets,permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer.A 3D waveguide fanout design provided an attractive balancing of low losses,modematching,high channel density,compact footprint,and low crosstalk.The 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects,with possible broader applications in integrated biophotonic chips or micro-displays.
机译：在过去的十年中，在过去的十年中已经进行了大踏步进步，以建立先进的制造系统中的飞秒激光，以实现透明材料的新形式的非接触式处理。研究进步表明，灵活的2D和3D现在可以进行无数的添加剂和减法技术。用微型和纳米尺度精确的这种材料的结构化。本文已经精制和缩放了这些技术，以证明高密度光学封装部件的3D写入的可能性，具体地解决了有效连接光纤的主要瓶颈对于用于电信和数据中心的硅光子（SIP）处理器。将MIDORE纤维（MCF）的高密度边缘耦合引入到SIP芯片上的高密度升压二氧化硅插入器。重复激光照射，然后进一步蚀刻利用打开的对准插座，允许快速装配，精确地锁定MCF位置以获得有效的切换在interpoyer中的激光书面光波导。3D波导扇出设计提供了低损耗，调制性，高通道密度，紧凑型占地面积和低串扰的有吸引力的平衡。3D添加剂和减法过程如此证明了更高规模集成的可能性电信互连的微光学元件的快速光子组件和包装，具有集成的生物光学芯片或微显示器中可能更广泛的应用。

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