首页> 中文期刊> 《工程热物理学报》 >R-113圆形射流冲击模拟电子芯片单相对流换热的实验研究

R-113圆形射流冲击模拟电子芯片单相对流换热的实验研究

         

摘要

Experimental study was performed to simulate the cooling of LSI chip impinged by R-113 jets. The local heat transfer characteristics of a simulated heater of 5x5 mm were investigated under the conditions of free-surface jet and submerged jet. The diameter of the nozzle was 534μm and the range of Reynolds number was 4900~37000. The influence of Re, the nozzle-to-target spacing and the lateral distance from the stagnation point on the heat transfer has been discussed thoroughly. The results revealed that the secondary peak of the distribution curve of the local heat transfer coefficient can occurs only in submerged jet impingement.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号