To judge and analyze nA level electric leakage found during device test, and to put forward solutions. The article introduces the method of judging and analyzing the nA level electric leakage of probe cards. First, the author confirms that the fault falls on PCB by judging and analyzing. Then he tests the PCB by its degree of moisture, insulating property, regional arrangement of columns of holes and so on. The result shows that when PCB production is limited by resistance welding bridge technology, the resistance welding bridges among annular rings will fall off and excessive leakage. To ensure the successful production of resistance welding bridge technology, the resistance welding bridges among annular rings will fall of and the base material will be exposed in the open air, which eventually leads to poor insulating property and excessive leakage. To ensure the successful production of resistance welding bridges, they can enlarge the visionary space or improve the resistance welding technology. Also they can material of higher electrical resistivity in order to improve the insulating properly of PCB.%针对器件测试过程中发现的nA级漏电现象进行判断和分析，并提出解决方案。介绍了探针卡nA级漏电故障判断与分析的方法，通过判断分析把故障原因锁定在PCB板上，然后对PCB板进行分析测试，分别从PCB吸潮情况、板材绝缘性能、孔列区域排布等方面进行试验。试验结果表明， PCB板制作时受到阻焊桥工艺能力的限制，孔环间阻焊桥脱落，孔环间基材裸露，最终导致该板绝缘性能较差，漏电超标。可以通过放大孔环间距或提高阻焊工艺能力的方法来保证阻焊桥的制作，同时使用具有较高电阻率的材料，提高PCB板的绝缘性能。
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