采用Sn3.5Ag（221℃）Indium8.9 T3-83.5%的焊膏，首先做了焊料的可焊性试验，随后设计了围框的密封焊试验，工艺样件由Cu80W镀金底板和柯伐镀金围框组成，在270℃恒定温度下，焊接时间2 min。最后对焊接后的样件做了X-ray空洞率及焊接层面微观检测分析并测量了IMC厚度。研究结果表明：不仅Sn3.5Ag焊料的可焊性好，而且在镀金层上的致密性也好，在X光透射下柯伐镀金围框的空洞率低于5%，只是随时可能产生的小气孔会严重影响焊接的密封性。%Sn3.5Ag(221℃)Indium8.9 T3-83.5% soldering paste was employed to do the weld ability test at the ifrst. Later, a smart plan was schemed for enclosure frame seal-welding experiments. The processing samples are made up of a Cu80W gold-plated substrate and two Kovar alloy enclosure frames with gold-plated. The welding temperature was set at 270℃constantly and time was about 2 minutes. At last, the packaged samples were used for X-ray penetration rate inspection, welding layer microanalysis and IMC thickness measurement. Results show that the spread-ability of Sn3.5Ag is good, the generated solder is actually compacted in the gold-plated inner layer and it also can be easily found that the Kovar alloy enclosure frame void ratio less than 5% based on the X-ray test. However, the small voids that may be produced at any time will have a strong impact on seal-welding.
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