随着电子组装无铅化进程的推进,传统的松香基助焊剂已很难适应无铅药芯焊锡丝的手工烙铁焊接工艺的需要。本试验研究了一种专用于无铅药芯焊锡丝的非松香基的固体助焊剂,并对其组成成分进行了优化设计。优化后的最佳成分配比为：己二酸（8%）、癸二酸（1%）、十八酸（36%）、松香（35%）、聚乙二醇（18%）、OP-10（0.9%）、十六烷基三甲基溴化胺（0.3%）、苯并三氮唑（0.5%~1%）。该助焊剂在110℃～130℃范围内能够完全熔化并呈均匀的液体状,在80℃以下可以完全固化,满足药芯焊锡丝的灌芯及拔丝工艺的要求。采用该助焊剂制备的药芯焊锡丝所焊接的焊点外形规则饱满,与现有松香基含卤素助焊剂具有同等助焊能力。其焊接残留物在170℃高温环境中30min无变色,满足高温电子器件焊接的需要,完全可以取代目前广泛使用的松香基含卤素助焊剂而用于药芯焊锡丝的生产实践当中。%As the development of lead-free solder in electronic assembly,traditional flux can not meet with the requirement of lead-free soldering process.In this paper,a non-rosin-based solid flux which used in the cored solder wire was developed.The formula ingredients of the new flux was optimized.The best ingredients content of this flux as follows：adipic acid（8.0wt%）,sebacic acid（1.0wt%）,stearic acid（36.0wt%）,rosin（35.0wt%）PEG（18.0wt%）,OP-10（0.9wt%）,CTAB（0.3wt%）,benzotriazole（0.5wt%~0.1wt%）.This flux will become homogeneous liquid when it is heated to 110℃～130℃ and it will freeze entirely below 80℃,so it can meet with the requirement of the cored solder wire manufacture.Compared with the traditional rosin-based flux containing halogen,this flux has the same wettability.The joint soldered with this flux is plump and light.Furthermore,after soldering,the residues at the joint surface did not change color when heated at170℃for 30 minutes.The flux can meet with the needs of high-temperature electronic devices and can replace the rosin-based flux.
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