首页> 中文期刊> 《电镀与涂饰》 >铜包覆空心玻璃微球复合粒子的制备与表征

铜包覆空心玻璃微球复合粒子的制备与表征

         

摘要

先采用聚乙烯吡咯烷酮(PVP)对空心玻璃微球(HGM)进行表面改性,再分别以铜氨离子为铜源、水合肼为还原剂、改性HGM为基体材料,采用无钯活化的化学镀法制得均匀包覆铜的HGM核壳复合粒子。采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)和傅里叶变换红外光谱仪(FT-IR)分析了铜包覆HGM复合粒子的形貌、结构和成分。结果表明,反应温度为60°C时,铜包覆HGM的效果最好。反应体系中低浓度的铜离子有利于还原所得铜粒子在HGM表面形成均匀、致密的铜层。%Hollow glass microspheres (HGM) were modified by polyvinylpyrrolidone (PVP), and then evenly coated with copper by palladium-free electroless copper plating using copper ammonia ions as copper source and hydrazine hydrate as reductant respectively to form core-shell composite particles. The micromorphology, structure, and composition of the copper- coated HGM core-shell composite were analyzed using scanning electron microscope (SEM), X-ray diffractometer (XRD), and Fourier-transform infrared spectrometer (FT-IR). The results showed that the copper coating effect on HGM is the best at a temperature of 60 °C. Low concentration of copper ions in reaction system is favorable for the formation of uniform and compact copper coating through the reduced copper particles on HGM surface.

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