In the paper,an experimental test scheme was designed to measure the equivalent thermal conductivity of the silicon steel lamination under different temperature and pressure.By parameter re-gression analysis,we got the quantitative relationship between the equivalent thermal conductivity with temperature and pressure.The experimental results show that the equivalent thermal conductivity of sil-icon steel increases with the increase of interfacial pressure at a certain temperature.The equivalent thermal conductivity of the unloading process is higher than that of the loading process.The higher the temperature, the greater the difference between the values of the equivalent thermal conductivities measured under loading and unloading.When the pressure is constant,the equivalent thermal conduc-tivity decreases as the temperature increases.The higher the pressure,the smaller the change of the e-quivalent thermal conductivity with the temperature.%文章设计了硅钢叠片等效热导率的实验测试方案,测量不同温度、压强条件下硅钢叠片的等效热导率,最终通过参数回归分析的方法,得到等效热导率随着温度、压强的定量化的变化规律.实验结果表明,在温度一定时,硅钢片之间的等效热导率随界面压强的增大而增大;压强卸载过程的等效热导率高于压强加载过程的等效热导率,并且温度越高,加载和卸载测得的等效热导率数值差别越大;当压强一定时,硅钢片之间的等效热导率随着温度的升高而降低,且压强越大,等效热导率随温度的变化越小.
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