The influence of resin content on the dielectric performance,thermal stability and moisture and hot performance of epoxy resin-based copper clad laminate(CCL) was investigated. The results show that the influence of resin content on relative dielectric constant conforms to logarithmic mixing method,and resin content has significant effects on thermal stability and hot performance of CCL.The decomposition of excellent heat resistance system happen at a slow pace in initial stage. The influence of resin conten on the initial stage of thermal decomposition is obvious. With increasing of resin content,the moisture and hot performance of material becomes better firstly,and then becomes worse.The moisture and hot performance is best when resin content is 43%.%研究了树脂含量对环氧树脂基覆铜板介电性能、热稳定性和耐湿热性能的影响。结果表明，树脂含量对相对介电常数的影响符合对数混合法规律；树脂含量对覆铜板基材的热稳定性和耐热性能有显著影响，在热分解起始阶段耐热性较优的配方体系失重缓慢进行，树脂含量对热分解起始阶段的影响较显著。随着树脂含量的增加，基材的耐湿热性能先变好后变差，树脂含量为43%时覆铜板基材耐湿热性能最优。
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