过定向复配催化技术和程序温控工艺,合成分子量高、分子量分布窄的A阶酚醛树脂.通过调节发泡剂、固化剂的种类和用量及发泡压力、加热速率和时间制得酚醛微孔材料.研究了酚醛微孔材料的微观形貌,热性能和耐火极限性能.试验表明,制得的酚醛微孔材料密度均匀,泡孔较小且排列致密,孔径20～100 nm.酚醛微孔材料的DSC曲线在80～120 ℃有一个放热峰.这是体系固化所致；在175～220 ℃有一个吸热峰,应是体系内小分子挥发所引起的.抗火焰穿透时间可达0.93 h,具有良好的耐火性能,可成为替代聚苯乙烯的一种新型建筑保温阻燃材料.%Phenolic resin with high molecular weight and narrow molecular weight distribution has been synthesized by oriented mixed catalytic technique and program temperature control technology. The phenolic resin foam thermal insulation material has been prepared by adjusting the kinds and the quantity of foaming agent and curing agent,the foaming pressure,the heating rate and the heating time. The microstructure, thermal properties and anti-flame penetration capacity of the phenolic resin were studied. The experiments showed that the phenolic foam produced here have uniform pore diameter between 20 nm and 100 nm. The DSC curve of the phenolic resin foam thermal insulation material has a exothermic peak between 80 ℃ and 120℃ , and a endothermic peak between 175 ℃ and 220 ℃ , caused by solidify and micromolecule volatilization. It can prevent flame more than 0. 93 h and has good fireproof property which could make it a potential building material instead of polysterol sandwich plate.
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