探究了温度、时间、食品模拟物、氧气,以及聚丙烯(polypropylene,PP)的3种结构(PP-B、PP-R和PP-H)对纳米铜/PP复合膜中铜向食品模拟物迁移的影响.将含有纳米铜和经3-氨丙基三乙氧基硅烷((3-Aminopropyl) triethoxysilane,KH550)处理的纳米铜分别添加到PP-B、PP-R和PP-H母粒中制备成相应的纳米铜/PP复合膜.在20、40和70℃下,将复合膜浸泡在食品模拟物中进行迁移实验.铜向食品模拟物的迁移率随着时间和温度的增加而增大直至平衡.酸性食品模拟物中迁移平衡时,在20℃,纳米铜/PP-B复合膜中铜的迁移率最大,PP-R和PP-H中铜的迁移率无显著性差异;40℃时,纳米铜/PP-H中铜的迁移率最大,PP-B和PP-R中铜的迁移率无显著性差异;而在70℃时,仍然是PP-H中铜的迁移率最大,PP-R次之,PP-B中铜的迁移率最小.%Temperature,exposure time,food simulants,oxygen,and three kinds of structure (PP-B,PP-R and PP-H) on the migration of copper from nanocopper/PP composite films into the food stimulants were investigated.Nanocopper and modified nanocopper by (3-Aminopropyl) triethoxysilane (KH550) were mixed with PP granules,new granules containing nanocopper and modified nanocopper were added into the composite films by a film-blowing machine.The films were exposed to food simulants at 20,40 and 70 ℃.The results showed that with the increase of exposure time and temperature,the copper release was increased.When equilibrium is reached in acidic food simulants,at 20 ℃,nanocopper/PP-B has the maximum copper migration ratio,and no big significant difference between PP-R and PP-H;at 40 ℃,PP-H has a maximum copper immigration rate,and no significant difference in PP-B and PP-R compared with;at 70 ℃,copper migration rate in PP-H is still the greatest,followed by pp-R and PP-B has the minimum rate.
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