首页> 中文期刊> 《电子科技学刊:英文版》 >Characteristics and Electrical Properties of SiNx:H Films Fabricated by Plasma-Enhanced Chemical Vapor Deposition

Characteristics and Electrical Properties of SiNx:H Films Fabricated by Plasma-Enhanced Chemical Vapor Deposition

         

摘要

SiNx:H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition (PECVD). Composition and structure characteristics are detected by Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.

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