首页> 中文期刊> 《电子科学学刊:英文版》 >A SIMPLE APPROACH TO THE CALCULATION OF THE MECHANICAL STRESS IN SILICON DEVICES

A SIMPLE APPROACH TO THE CALCULATION OF THE MECHANICAL STRESS IN SILICON DEVICES

         

摘要

The residual mechanical stress in SiO2 films results in the degradation of mobilitiesin MOSFETs. Based on the edge force approximation in SiO2 films, the stress field in MOS devicesis calculated. The results here are in agreement with those measured by the Raman spectrummethod.

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