为解决镍基金刚石复合电沉积过程中普遍存在镀层沉积速率慢、镀层内应力大的问题，本工作以新型高速Ni镀液为基础，考查了镀液中去应力添加剂含量、工艺参数，以及金刚石含量对镀层内应力影响的规律，并对复合镀层的微观形貌进行了表征。优选出了可以在30A／dm2的高阴极电流密度下快速电沉积低应力镍基金刚石复合镀层的镀液组成及工艺条件。结果表明：当镀液组成为十二烷基硫酸钠0．5g／L，乙酸铵3g／L，柠檬酸三钠1．5g／L，金刚石微粒浓度30g／L ；施镀条件为pH值3～4，温度50℃时，制得的复合镀层内应力最低。%Nickel/diamond composite coatings were prepared on the basis of a new high speed electro‐plating bath .The influence of additives ,plating parameters and diamond concentration on internal stress was investigated in order to find the solution to decrease the stress introduced by high current density ;the micro morphology of the coatings were observed by SEM .The bath and depositing pa‐rameters were optimized that thick nickel/diamond composite coatings with low internal stress can be high speed electroplated with a high cathode current density of 30A/dm2 .The results show that when plated with bath composition and parameters as follows :sodium dodecyl sulfate 0 .5g/L ,ammonium acetate 3g/L ,sodium citrate 1 .5g/L ,diamond particles 30g/L ;pH value 3‐4 ,temperature 50℃ ,the composite coatings prepared in high speed have the lowest internal stress .
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