Radio-frequency(RF)process products suffer from a wafer edge low yield issue,which is induced by contact opening.A failure mechanism has been proposed that is based on the characteristics of a wafer edge film stack.The large step height at the wafer's edge leads to worse planarization for the sparse poly-pattern region during the inter-layer dielectric(ILD)chemical mechanical polishing(CMP)process.A thicker bottom anti-reflect coating(BARC)layer was introduced for a sparse poly-pattern at the wafer edge region.The contact open issue was solved by increasing the break through(BT)time to get a large enough window.Well profile and resistance uniformity were obtained by contact etch recipe optimization.
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