首页> 中文期刊> 《低压电器》 >小型断路器导电回路温度场的仿真与分析

小型断路器导电回路温度场的仿真与分析

         

摘要

通过建立小型断路器导电回路的三维有限元模型,采用电-热直接耦合法计算不同工作状态下导电回路的温升,研究接触压力对触头表面温度的影响,分析外壳温度分布情况,并通过温升试验对仿真结果进行了验证.利用导电回路热分析的结果,对串联在主回路中的热双金属片的脱扣特性进行了计算,分析相关标准要求下的热脱扣器温升和位移情况.%The internal heating situations of miniature circuit breaker have an important influence on its structure of life and job characteristics.Through the establishment of three-dimensional finite element model of miniature circuit breaker conductive circuit, the conductive circuit of temperature rise under different working condition was calculated by the electric-thermal direct coupling method.From this analysis, the effect of contact pressure on the contact surface temperature and the temperature distribution of the shell were studied, and the simulation results were verified by the temperature rise experiment.By using the results of the conductive loop thermal analysis, the tripping characteristics of thermal bimetallic strip which is connected within the circuit in series were calculated, the thermal trip temperature rise and displacement were also searched under relevant standards requirement.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号