Analysis of Current Research Status of Plasma Etch Process Model

著录项

• 来源
  《微电子制造学报》 |2018年第1期|P.21-34|共14页
• 作者

  Xiaoting Li; Rui Chen; Lei Qu; Xuanmin Zhu; Jing Zhang; Yanrong Wang; Shuhua Wei; Jiang Yan; Yayi Wei;

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• 作者单位

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [2]Key Laboratory of Microelectronic Devices&Integrated Technology;

  Institute of Microelectronics of Chinese Academy of Sciences;

  Beijing 100029;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [1]North China University of Technology;

  Beijing 100144;

  China;

  [2]Key Laboratory of Microelectronic Devices&Integrated Technology;

  Institute of Microelectronics of Chinese Academy of Sciences;

  Beijing 100029;

  China;

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• 原文格式 PDF
• 正文语种 CHI
• 中图分类 无线电电子学、电信技术;
• 关键词

  plasma etching; etching model; simulation;