Material Modeling in Semiconductor Process Applications

Boris A.Voinov; Patrick H.Keys; Stephen M.Cea; Ananth P.Kaushik; Mark A.Stettler

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Material Modeling in Semiconductor Process Applications

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During the past decade,significant progress has been achieved in the application of material modeling to aid technology development in semiconductor manufacturing companies such as Intel.In this paper,we review examples of applications involving a complex set of material modeling tools and methodologies and share our perspective of the future of the area.Examples are given illustrating the landscape of useful physical models and approaches along with commentary addressing tool relevance and simulation efficiency issues.While the scope of this paper precludes providing in-depth details,references to more focused publications are shared.Finally,we outline how to approach constructing a general infrastructure for supporting TCAD material modeling applications.

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《微电子制造学报》 |2020年第4期|P.40-50|共11页
作者
Boris A.Voinov; Patrick H.Keys; Stephen M.Cea; Ananth P.Kaushik; Mark A.Stettler;
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作者单位

Logic Technology Development Intel Corporation Nizhniy Novgorod Russian Federation 603024;

Logic Technology Development Intel Corporation Hillsboro OR USA 95124;

Logic Technology Development Intel Corporation Hillsboro OR USA 95124;

Nonvolatile Memory Solutions Group Intel Corporation Santa Clara California USA 95054;

Logic Technology Development Intel Corporation Hillsboro OR USA 95124;

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原文格式 PDF
正文语种 chi
中图分类半导体技术;
关键词
TCAD; atomistic modeling; density functional theory; molecular dynamics; kinetic Monte Carlo.;

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Material Modeling in Semiconductor Process Applications

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