微孔聚酰亚胺不仅具有聚酰亚胺的低介电、耐高低温等特性,而且兼备了微孔材料的密度小、质轻等诸多优点,起始分解温度一般在250℃以上,介电常数一般在2.5左右,平均密度一般小于0.3g/cm3,在航空航天、微电子领域都有应用前景.综述了微孔聚酰亚胺的制备方法,结合耐热性能、力学性能、介电常数、吸声性能等的表征,总结了微孔聚酰亚胺的研究方法,并展望了微孔聚酰亚胺的应用前景.%Microporous polyimide not only has the properties of polyimide such as low dielectric, high temperature resistance, but also has low density, light weight, and many other advantages of the microporous materials. Its starting decomposition temperature is above 25O℃ commonly, dielectric constant is about 2. 5 in general and the average density is less than 0. 3g/cm3. In addition, it has application prospect in aerospace and microelectronics area. The preparation method of the microporous polyimide is reviewed, the characterization methods of the properties such as heat resistance, mechanical strength, dielectric constant, sound absorption and other aspects are summarized, and the application prospect of microporous polyimide is discussed.
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