采用固相法制备多孔道ITO材料,主要研究了ITO粉末成型压力为93MPa的素坯在不同烧结温度条件下的物相、显微组织、体积收缩率及孔道结构.研究结果表明,93MPa的素坯在600℃保温1h、1300℃保温3h工艺条件下所获得的ITO材料孔道结构较好,孔径较规则且分布均匀；随着烧结温度的升高,ITO材料体积收缩率变大,当温度超过1300℃后,ITO材料颗粒长大明显,导致该材料部分孔道弥合,不利于形成均匀分布的多孔道结构的气敏材料.%The porous ITO material was prepared by using solid-phase method. The phase, microstructure, volume shrinkage rate and pore structure of biscuit of ITO were studied at different sintering temperatures and in pres-sure of 93MPa. The results show that ITO material with better pore structure of the biscuit and uniform distributing as well as regular pore size was prepared by preserving heat at 600℃ for lh and then at 1300℃ for 3h in 93MPa; with the sintering temperature increasing, volume shrinkage rate of ITO material also kept increasing; when the tempera-ture was beyond 1300 ℃ , the particles of ITO material grew significantly and it led to some channel bridge which went against forming sensitive material with regular pore structure.
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