State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;
State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;
State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;
State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;
State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;
State Key Laboratory of Advanced Welding and Joining;
Harbin Institute of Technology (Shenzhen);
Center of Flexible and Printable Electronics;
Harbin Institute of Technology (Shenzhen);
Department of Materials Science and Science;
City University of Hong Kong;
Singapore Institute of Manufacturing Technology;
Institute of Textiles and Clothing;
The Hong Kong Polytechnic University;