The paper describes that the superiority of ENEPIG in the surface finish.Compareed ENEPIG with the ENIG,it,it not only applicable to IC package,but also improves the reliability and decreases the cost.%概述了化学镀镍/化学镀钯/浸金涂（镀）覆层的优点,它比起化学镀镍/浸金,不仅更适用于IC封装,而且提高了可靠性,降低了成本。
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