球栅阵列(BGA)焊点焊接过程中容易产生气泡,形成空洞缺陷,检测时如何自动分析一直是个难题.提出使用Otsu算法分割焊球,使用数学形态学中的开闭运算、顶帽变换提取空洞缺陷的技术方案,实现每个焊点空洞缺陷的准确提取和自动分析.实验结果表明,提出的技术方案鲁棒性强,可应用于BGA焊点的空洞缺陷检测.%In the welding process of BGA solder joints,it is easy to produce bubbles and form void defects which are difficult to analysis automatically during testing.A technique solution is proposed that the solder balls are sepa-rated by Otsu algorithm,the void defects are segmented by the open and close operations and the top-hat transform of mathematical morphology.The solution can be used to achieve the seamless extraction of void defects and auto-matic analysis in each solder ball.The experimental results show that the proposed scheme is robust and can be ap-plied to detection of void defects in BGA solder joints.
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