The glasses for multiple layer electronic circuit packaging substrates were studied.FIIR as well as dielectric properties were tested.There is avoidance of linkages between tetrahedral aluminum and tetrahedral boron groups in aluminoborosilicate glass.With B2O3 replacing Al2O3,content of tetrahedral aluminum decreases.But it promotes the formation of trigonal over tetrahedral boron.Dielectric constant ε and dielectric loss angle tanδ decline.%研究了一组用于低温共烧多层陶瓷基板和印刷电路基板的低损耗玻璃材料。测定了玻璃FTIR光谱以及介电性能。因[AlO4]/[BO4]四面体回避原则,随着B2O3取代Al2O3玻璃体系中的[AlO4]含量减少,[BO3]逐渐向[BO4]转化,介电常数ε减小,玻璃网络结构更加致密,介电损耗降低。
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