介绍了水面舰艇射频电子设备的发展情况和国外水面舰艇射频集成、上层建筑(桅杆)射频综合集成情况.指出射频集成和上层建筑(桅杆)射频综合集成是电子、电磁兼容、舰船设计、结构、材料等各学科交叉的系统工程研制项目,应由舰船设计部门与电子设备研制部门大力协同而有步骤地进行.射频集成工作由电子设备研制机构进行.舰船总体研制单位自始至终负责射频集成和上层建筑(桅杆)射频综合集成工作,必须设计制造上层建筑(桅杆)射频综合集成大型模型,进行上层建筑(桅杆)射频综合集成的陆上试验,验证集成射频电子设备性能以及上层建筑(桅杆)射频综合集成后的隐身性和电磁兼容性能；试验成功后装舰.%This article describes the development of shipboard electronic equipment and the development of RF integration and topside RF integration on foreign surface ships. It stated that RF integration on the topside is a interdisciplinary research projects of electronic, electromagnetic compatibility, ship design, structure and materials. Ship design department should be developed with the electronics sector collaboration and systematically carried out vigorously. RF integration developed by the electronic agencies. Ship design department should responsible for RF integration and topside integrity all the time: the unit must design and manufacture a large scale integrated model of the topside and conduct a land-based integrated test to verify performance of RF electronic devices and the performance of stealth and electromagnetic compatibility of the superstructure. The topside would be fitted on ship after successful test.
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