Pressureless infiltration processing and thermal properties of SiCp/Al composites with high SiC particle content

周贤良; 邹爱华; 华小珍; 张建云; 饶有海

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Pressureless infiltration processing and thermal properties of SiCp/Al composites with high SiC particle content

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＜正＞SiCp/1060Al, SiCp/ZL101,SiCp/ZL102 composites with SiCp volume fraction of 55% were fabricated by pressureless infiltration. The microstructure was examined and thermal properties were characterized for SiCp/Al composites. The results show that the composites are dense and macroscopically homogeneous. With the increase of temperature, the mean linear coefficient of thermal expansion（CTE） at 25-200℃of the composites increases and ranges from 7.23×10-6 to 10.4×10-6K-1, but thermal conductivity declines gradually at the same time. With the increase of Si content in the Al matrix, CTE of the composites declines and thermal conductivity also declines but not linearly, when Si content is up to 7%, the average thermal conductivity is 140.4 W/（m·K）, which is close to that of the SiCp/1060Al composite （144.6 W/（m·K））. While Si content is 11.7%, the average thermal conductivity declines markedly to 87.74 W/（m·K）. The annealing treatment is better than the solution aging treatment in reducing CTE and improving thermal conductivity of the composites. Compared with conventional thermal management materials, SiCp/Al composites are potential candidate materials for advanced electronic packaging due to their tailorable thermo-physical properties.

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《中国有色金属学报：英文版》 |2006年第s3期|1552-1556|共5页
作者
周贤良; 邹爱华; 华小珍; 张建云; 饶有海;
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作者单位

Department of Material Engineering Nanchang Institute of Aeronautical Technology;

Nanchang 330034;

China;

Department of Material Engineering;

Nanchang Institute of Aeronautical Technology;

Nanchang 330034;

China;

Department of Material Engineering;

Nanchang Insti;

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原文格式 PDF
正文语种 chi
中图分类金属复合材料;
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机译：SiCp / Al复合材料;无压渗透;热膨胀系数;导热系数;

Pressureless infiltration processing and thermal properties of SiCp/Al composites with high SiC particle content

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