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首页> 美国卫生研究院文献>Materials >Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens
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Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens

机译：纤维板内的应变测量。第三部分：分析中密度纤维板（MDF）双悬臂工字梁样品的裂纹尖端处的工艺区域

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This paper is the third part of a study dealing with the mechanical and fracture mechanical characterization of Medium Density Fiberboards (MDF). In the first part, an analysis of internal bond strength testing was performed and in the second part MDF was analyzed by means of the wedge splitting experiment; this part deals with the double cantilever I beam test, which is designed for measuring the fracture energy as well as stress intensity factor in Mode I. For a comparison of isotropic and orthotropic material behavior, finite element modeling was performed. In addition to the calculation of fracture energy the stress intensity factor was analyzed by means of finite elements simulation and calculation. In order to analyze strain deformations and the process zone, electronic speckle pattern interferometry measurements were performed. The results revealed an elongated process zone and lower results for KIC if compared to the wedge splitting experiment. The Gf numbers are higher compared to the wedge splitting results and can be explained by the thicker process zone formed during the crack propagation. The process zone width on its part is influenced by the stiff reinforcements and yields a similar crack surface as with the internal bond test.
机译：本文是研究中密度纤维板（MDF）的力学和断裂力学特性的第三部分。在第一部分中，进行了内部粘结强度测试的分析，在第二部分中，通过楔形劈裂实验分析了MDF。此部分处理双悬臂I型梁测试，该测试旨在测量模式I中的断裂能以及应力强度因子。为了比较各向同性和正交异性材料的行为，进行了有限元建模。除了计算断裂能外，还通过有限元模拟和计算来分析应力强度因子。为了分析应变变形和过程区域，进行了电子散斑图干涉测量。结果表明，与楔形劈裂实验相比，KIC的加工区域更长，结果更低。与楔形劈裂结果相比，Gf值更高，并且可以用裂纹扩展过程中形成的较厚的加工区来解释。加工区的宽度受刚性增强材料的影响，并产生与内部粘结试验相似的裂纹表面。

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