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首页> 美国卫生研究院文献>Materials >Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy
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Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

机译：生长速率和磁场对定向凝固Ag-Cu共晶合金组织和性能的影响

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摘要

We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry.
机译：我们报告了生长速度和外部磁场对定向凝固Ag-Cu共晶合金的共晶层间距和性能的影响。结果表明，定向凝固Ag-Cu合金的层间距与生长速率的关系符合Jackson-Hunt模型的预测，常数为5.8 µm 3 / s。凝固过程中不断增加的外部磁场使层状共晶的生长方向倾斜，并增大了共晶层状间距。这些降低了Ag-Cu合金的显微硬度和强度，但是增加了它们的电导率。共晶层间距的细化与共晶生长方向的变化之间的竞争性增强作用导致在0.8 T磁场下的轧制样品比其他样品具有更高的强度，这可以从较高的释放变形能中得到证实。使用差示扫描量热法。

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