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Kinetic Phase Diagrams of Ternary Al-Cu-Li System during Rapid Solidification: A Phase-Field Study

机译：快速凝固过程中三元Al-Cu-Li体系的动力学相图：相场研究

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摘要

Kinetic phase diagrams in technical alloys at different solidification velocities during rapid solidification are of great importance for guiding the novel alloy preparation, but are usually absent due to extreme difficulty in performing experimental measurements. In this paper, a phase-field model with finite interface dissipation was employed to construct kinetic phase diagrams in the ternary Al-Cu-Li system for the first time. The time-elimination relaxation scheme was utilized. The solute trapping phenomenon during rapid solidification could be nicely described by the phase-field simulation, and the results obtained from the experiment measurement and/or the theoretical model were also well reproduced. Based on the predicted kinetic phase diagrams, it was found that with the increase of interface moving velocity and/or temperature, the gap between the liquidus and solidus gradually reduces, which illustrates the effect of solute trapping and tendency of diffusionless solidification.
机译：在快速凝固过程中，不同凝固速度下的技术合金中的动力学相图对于指导新型合金的制备非常重要，但由于进行实验测量极其困难，因此通常不存在。本文首次采用界面耗散有限的相场模型在三元Al-Cu-Li体系中构建动力学相图。利用了时间消除松弛方案。通过相场模拟可以很好地描述快速凝固过程中的溶质截留现象，并且还可以很好地再现从实验测量和/或理论模型获得的结果。根据预测的动力学相图，发现随着界面运动速度和/或温度的增加，液相线和固相线之间的间隙逐渐减小，这说明了溶质俘获的效果和无扩散凝固的趋势。

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