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首页> 美国卫生研究院文献>Materials >Comparative Research on the Rebound Effect in Direct Electromagnetic Forming and Indirect Electromagnetic Forming with an Elastic Medium
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Comparative Research on the Rebound Effect in Direct Electromagnetic Forming and Indirect Electromagnetic Forming with an Elastic Medium

机译：弹性介质直接电磁成型与间接电磁成型回弹效果的比较研究

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摘要

In the process of electromagnetic forming (EMF), the rebound effect caused by high speed collision between sheet and die will affect the fittability, which results in a bad forming quality of workpiece. In this paper, finite element models of direct EMF and indirect EMF with an elastic medium are established, the influence factors of fittability in indirect EMF are studied, the two forming processes are compared, and the mechanisms of reduced rebound effect in indirect EMF are revealed. The results show that: in indirect EMF, with the increase of the discharging voltage or thickness of rubber, the fittability increases and then decreases; when the thickness of driver plate is equal to the skin depth of the driver plate, the fittability is the best. The optimal process parameters of indirect EMF are as follows: the discharging voltage is 10 kV, the thickness of the rubber is 20 mm and the thickness of driver plate is 2 mm. The rebound effect in indirect EMF is reduced compared with direct EMF for the following reasons: the impact force caused by the collision between the sheet and die is balanced by the pressure provided by the rubber; the sheet is always under tensile stress state due to the friction force provided by rubber; the remaining kinetic energy of sheet after collision with the die is absorbed by rubber. Therefore, the rebound effect in indirect EMF is suppressed compared with direct EMF. So, the fittability of the workpiece is improved, which results in a better forming quality.
机译：在电磁成型（EMF）过程中，板材与模具之间的高速碰撞所引起的回弹效应会影响装配性，从而导致工件的成型质量变差。本文建立了直接EMF和具有弹性介质的间接EMF的有限元模型，研究了间接EMF拟合的影响因素，比较了两种成形过程，揭示了间接EMF降低回弹效应的机理。 。结果表明：在间接电动势中，随着放电电压的增加或橡胶厚度的增加，拟合度先升高后降低。当驱动板的厚度等于驱动板的表皮深度时，装配性最佳。间接EMF的最佳工艺参数如下：放电电压为10 kV，橡胶厚度为20 mm，驱动板厚度为2 mm。与直接EMF相比，间接EMF的回弹作用降低了，原因如下：片材与模具之间的碰撞所引起的冲击力被橡胶提供的压力所平衡；由于橡胶提供的摩擦力，片材始终处于拉应力状态。与模具碰撞后，板材的剩余动能被橡胶吸收。因此，与直接EMF相比，间接EMF中的回弹效应得到了抑制。因此，提高了工件的装配性，从而导致更好的成型质量。

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