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Study of the Dynamic Recrystallization Process of the Inconel625 Alloy at a High Strain Rate

机译：Inconel625合金高应变速率下动态再结晶过程的研究

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摘要

High-temperature compression and electron backscatter diffraction (EBSD) techniques were used in a systematic investigation of the dynamic recrystallization (DRX) behavior and texture evolution of the Inconel625 alloy. The true stress–true strain curves and the constitutive equation of Inconel625 were obtained at temperatures ranging from 900 to 1200 °C and strain rates of 10, 1, 0.1, and 0.01 s−1. The adiabatic heating effect was observed during the hot compression process. At a high strain rate, as the temperature increased, the grains initially refined and then grew, and the proportion of high-angle grain boundaries increased. The volume fraction of the dynamic recrystallization increased. Most of the grains were randomly distributed and the proportion of recrystallized texture components first increased and then decreased. Complete dynamic recrystallization occurred at 1100 °C, where the recrystallized volume fraction and the random distribution ratios of grains reached a maximum. This study indicated that the dynamic recrystallization mechanism of the Inconel625 alloy at a high strain rate included continuous dynamic recrystallization with subgrain merging and rotation, and discontinuous dynamic recrystallization with bulging grain boundary induced by twinning. The latter mechanism was less dominant.
机译：高温压缩和电子背散射衍射（EBSD）技术用于Inconel625合金的动态重结晶（DRX）行为和织构演变的系统研究。在900至1200°C的温度以及10、1、0.1和0.01 s -1 的应变率下获得了Inconel625的真实应力-真实应变曲线和本构方程。在热压缩过程中观察到了绝热加热效果。在高应变率下，随着温度的升高，晶粒开始细化，然后长大，高角度晶界的比例也增加。动态重结晶的体积分数增加。大多数晶粒是随机分布的，重结晶织构成分的比例先增加然后减少。完全动态再结晶在1100°C发生，其中再结晶的体积分数和晶粒的无规分布比达到最大值。研究表明，Inconel625合金在高应变速率下的动态再结晶机理包括亚晶粒合并和旋转的连续动态再结晶，以及孪晶引起的晶界膨胀的不连续动态再结晶。后一种机制不那么占主导地位。

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