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A New Way of Toughening of Thermoset by Dual-Cured Thermoplastic/Thermosetting Blend

机译：双固化热塑性/热固性混合物增韧热固性的新方法

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摘要

The work aims at establishing the optimum conditions for dual thermal and electron beam curing of thermosetting systems modified by styrene/butadiene (SB)-based triblock copolymers in order to develop transparent and toughened materials. The work also investigates the effects of curing procedures on the ultimate phase morphology and mechanical properties of these thermoset–SB copolymer blends. It was found that at least 46 mol% of the epoxidation degree of the SB copolymer was needed to enable the miscibility of the modified block copolymer into the epoxy resin. Hence, an electron beam curing dose of ~50 kGy was needed to ensure the formation of micro- and nanostructured transparent blends. The micro- and nanophase-separated thermosets obtained were analyzed by optical as well as scanning and transmission electron microscopy. The mechanical properties of the blends were enhanced as shown by their impact strengths, indentation, hardness, and fracture toughness analyses, whereby the toughness values were found to mainly depend on the dose. Thus, we have developed a new route for designing dual-cured toughened micro- and nanostructured transparent epoxy thermosets with enhanced fracture toughness.
机译：这项工作的目的是为由苯乙烯/丁二烯（SB）基三嵌段共聚物改性的热固性体系建立双热和电子束固化的最佳条件，以开发透明和增韧的材料。这项工作还研究了固化程序对这些热固性SB共聚物共混物的最终相形态和机械性能的影响。已经发现，需要至少46mol％的SB共聚物的环氧化度以使改性的嵌段共聚物与环氧树脂混溶。因此，需要约50 kGy的电子束固化剂量以确保形成微结构和纳米结构的透明共混物。通过光学以及扫描和透射电子显微镜分析获得的微相和纳米相分离的热固性材料。如它们的冲击强度，压痕，硬度和断裂韧性分析所示，共混物的机械性能得到增强，由此发现韧性值主要取决于剂量。因此，我们开发了一条新的路线，以设计具有增强的断裂韧性的双固化增韧的微米和纳米结构透明环氧树脂热固性材料。

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