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首页> 美国卫生研究院文献>Sensors (Basel Switzerland) >Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study
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Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study

机译：光纤传感器在3D打印包装中用于土木工程应用的封装：初步研究

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Fiber optic sensors have considerable potential for measuring strains in the challenging environment posed by today’s civil engineering applications. Their long-term reliability and stability are particularly important attributes for assessing, with confidence, effects such as cracking and response to normal (and abnormal) loads. However, given the fragile nature of the bare fiber, the sensors must be packaged to achieve adequate robustness but the resulting increased cost of installation can frequently limit the number of sensors which can be installed or their use may have to be ruled out altogether due to these financial constraints. There is thus potential for the development of a more affordable type of packaging and this paper describes work undertaken to produce a cost-effective and easy-to-use technique for encapsulating fiber optic sensors in resin, taking advantage of 3D printing techniques which are widely available and at low cost. This approach can be used to produce a robust, inexpensive packaged sensor system which is seen as being suitable to be extended to a wider range of uses including installation in concrete structures prior to casting. To evaluate this approach, several such 3D printed package types and geometries are described and their behavior is assessed from a programme of laboratory trials, the results of which are presented in this paper. This proof-of-concept testing has demonstrated the considerable potential which 3D printed packages have and the scope for further development and consequent use in civil engineering applications. Areas showing promise and potential, which have been identified from the work undertaken, are discussed.
机译：光纤传感器具有在当今土木工程应用所带来的挑战性环境中测量应变的巨大潜力。它们的长期可靠性和稳定性对于可靠地评估诸如开裂和对正常（和异常）载荷的响应等影响尤其重要。但是，鉴于裸光纤的易碎性，必须包装传感器才能获得足够的坚固性，但是由此导致的安装成本增加会经常限制可以安装的传感器数量，或者由于以下原因而必须完全排除使用它们：这些财务限制。因此，有可能开发出价格更便宜的包装，本文将介绍利用3D打印技术来生产一种经济有效且易于使用的将光纤传感器封装在树脂中的技术的工作。可用且价格低廉。这种方法可用于生产坚固耐用，价格便宜的传感器系统，该系统被认为适合扩展到更广泛的用途，包括在铸造前安装在混凝土结构中。为了评估这种方法，描述了几种此类3D打印的包装类型和几何形状，并通过实验室试验计划评估了它们的行为，其结果在本文中进行了介绍。该概念验证测试证明了3D打印包装具有巨大的潜力，并具有进一步开发的范围以及随后在土木工程应用中的使用范围。讨论了从所开展的工作中发现的具有希望和潜力的领域。

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