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首页> 美国卫生研究院文献>Philosophical transactions. Series A Mathematical physical and engineering sciences >Single-photon imaging in complementary metal oxide semiconductor processes
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Single-photon imaging in complementary metal oxide semiconductor processes

机译：互补金属氧化物半导体工艺中的单光子成像

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This paper describes the basics of single-photon counting in complementary metal oxide semiconductors, through single-photon avalanche diodes (SPADs), and the making of miniaturized pixels with photon-counting capability based on SPADs. Some applications, which may take advantage of SPAD image sensors, are outlined, such as fluorescence-based microscopy, three-dimensional time-of-flight imaging and biomedical imaging, to name just a few. The paper focuses on architectures that are best suited to those applications and the trade-offs they generate. In this context, architectures are described that efficiently collect the output of single pixels when designed in large arrays. Off-chip readout circuit requirements are described for a variety of applications in physics, medicine and the life sciences. Owing to the dynamic nature of SPADs, designs featuring a large number of SPADs require careful analysis of the target application for an optimal use of silicon real estate and of limited readout bandwidth. The paper also describes the main trade-offs involved in architecting such chips and the solutions adopted with focus on scalability and miniaturization.
机译：本文介绍了通过单光子雪崩二极管（SPAD）在互补金属氧化物半导体中进行单光子计数的基础，以及基于SPAD的具有光子计数功能的微型像素的制作。概述了一些可能利用SPAD图像传感器的应用，例如基于荧光的显微镜检查，三维飞行时间成像和生物医学成像等。本文重点介绍最适合那些应用程序的架构及其所产生的折衷。在本文中，描述了在大型阵列中设计时可有效收集单个像素输出的体系结构。描述了片外读出电路要求，用于物理，医学和生命科学领域的各种应用。由于SPAD的动态特性，具有大量SPAD的设计需要仔细分析目标应用，以最佳利用硅面积并限制读取带宽。本文还描述了设计此类芯片时涉及的主要折衷方案，并重点介绍了可扩展性和小型化所采用的解决方案。

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