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Process and Microstructure to Achieve Ultra-high Dielectric Constant in Ceramic-Polymer Composites

机译:陶瓷-聚合物复合材料实现超高介电常数的工艺和微观结构

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摘要

Influences of process conditions on microstructure and dielectric properties of ceramic-polymer composites are systematically studied using CaCu3Ti4O12 (CCTO) as filler and P(VDF-TrFE) 55/45 mol.% copolymer as the matrix by combining solution-cast and hot-pressing processes. It is found that the dielectric constant of the composites can be significantly enhanced–up to about 10 times – by using proper processing conditions. The dielectric constant of the composites can reach more than 1,000 over a wide temperature range with a low loss (tan δ ~ 10−1). It is concluded that besides the dense structure of composites, the uniform distribution of the CCTO particles in the matrix plays a key role on the dielectric enhancement. Due to the influence of the CCTO on the microstructure of the polymer matrix, the composites exhibit a weaker temperature dependence of the dielectric constant than the polymer matrix. Based on the results, it is also found that the loss of the composites at low temperatures, including room temperature, is determined by the real dielectric relaxation processes including the relaxation process induced by the mixing.
机译:以CaCu3Ti4O12(CCTO)为填充剂,以P(VDF-TrFE)55/45%mol。%共聚物为基质,通过溶液浇铸和热压相结合的方法,系统地研究了工艺条件对陶瓷-聚合物复合材料微观结构和介电性能的影响。流程。发现通过使用适当的加工条件,复合材料的介电常数可以显着提高-高达约10倍。复合材料的介电常数可以在很宽的温度范围内达到1,000以上,损耗低(tanδ〜10 -1 )。结论是,除了复合材料的致密结构外,CCTO颗粒在基体中的均匀分布对介电增强起着关键作用。由于CCTO对聚合物基体微观结构的影响,复合材料的介电常数对温度的依赖性比聚合物基体弱。基于该结果,还发现在包括室温的低温下,复合材料的损失由包括混合引起的松弛过程在内的实际介电松弛过程确定。

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